Samsung Electronics recently announced the industry’s thinnest 12nm LPDDR5X DRAM chip, which is only 0.65 mm thick, aiming to meet the growing demand for artificial intelligence in mobile devices. This ultra-thin chip not only saves space, but also improves thermal management efficiency, providing a solid guarantee for high-performance applications in mobile devices. This move marks another breakthrough for Samsung in the field of memory technology, and also reflects its precise grasp of future mobile AI development trends.
Recently, Samsung Electronics announced that it has begun mass production of the industry's thinnest dynamic random access memory (DRAM) low-power memory chips to cope with the growing demand for artificial intelligence (AI) on mobile devices.
The 12 nanometer (nm), 12GB and 16GB LPDDR5X DRAM chips launched by Samsung this time are only as thin as a fingernail , marking the driving force of AI technology in the demand for electronic products.
Samsung leveraged its expertise in chip packaging to successfully create ultra-thin LPDDR5X DRAM packages. Not only does this design create more space for mobile devices, it also improves air circulation and helps with more efficient thermal management. With the continuous development of high-performance applications and complex functions, the importance of thermal management has become increasingly important, and Samsung's latest products are born at the moment.
Samsung's LPDDR5X DRAM chips also perform well in terms of performance. Company executive YongCheol Bae mentioned in the statement: "Our LPDDR5X DRAM sets a new standard for high-performance mobile AI solutions, not only superior in LPDDR performance, but also enabling advanced thermal management in an ultra-compact package . ” Samsung is committed to continuous innovation to meet the future needs of the low-power DRAM market through close cooperation with customers.
It is worth noting that Samsung’s new LPDDR5X DRAM package adopts a four-layer stacked structure, reducing the thickness by about 9%, while the thermal resistance performance is improved by 21.2% , which is even better than the previous generation product. By optimizing printed circuit board (PCB) and epoxy resin molding material (EMC) technology, the thickness of the new LPDDR DRAM package reaches 0.65 mm, which is currently the thinnest among LPDDR DRAMs above 12GB, further enhancing the competitiveness of the product.
In the future, Samsung plans to supply 0.65mm LPDDR5X DRAM to mobile processor manufacturers and mobile device manufacturers to continue to expand the low-power DRAM market. As the market demand for high-performance, high-density mobile memory solutions and smaller package sizes continues to grow, Samsung also plans to develop 6-layer 24GB and 8-layer 32GB modules to launch thinner LPDDR DRAM products to meet the needs of future devices .
Highlight:
Samsung has begun mass production of ultra-thin LPDDR5X DRAM chips aimed at meeting AI needs on mobile devices.
? The new memory is only 0.65 mm thick, which is thinner than the previous generation, and its thermal resistance performance is significantly improved.
Samsung plans to expand the low-power DRAM market and launch more high-performance, high-density memory solutions.
The ultra-thin LPDDR5X DRAM chip launched by Samsung not only represents a breakthrough in the field of memory technology, but also heralds the booming development of AI applications in mobile devices. In the future, Samsung will continue to innovate and provide more powerful memory support for mobile devices.