German artificial intelligence chip company Semron recently announced that it has received US$7.9 million in financing, which will be used to promote its innovation in the field of AI chips for mobile devices. With its unique 3D packaging technology and CapRAM technology, Semron is committed to improving the efficiency and performance of AI chips, with the goal of becoming a leader in the field of AI chips for smart devices. Its CapRAM technology is expected to increase the running volume of AI models by 1,000 times, which will bring more powerful AI processing capabilities to mobile devices.
German company Semron raised US$7.9 million with the goal of promoting AI chip innovation for mobile devices. Through 3D packaging technology, Semron expects to increase chip efficiency by 20 times. Its CapRAM technology uses variable capacitors to build a unique semiconductor architecture, allowing the AI model to run 1,000 times larger. After the capital injection, Semron plans to strengthen hardware and compiler development, expand the team, and focus on internationalization, striving to become a leading innovator in the field of AI chips for smart devices.
Semron's successful financing and technological innovation indicate that the field of mobile device AI chips will usher in new development opportunities. In the future, we will see more smart devices based on Semron technology and experience more powerful AI applications. The investment of this capital will help Semron stand out in the fierce market competition and bring users a more convenient and efficient AI experience.